Amkor Technology, Inc. (NASDAQ:AMKR – Get Free Report) declared a quarterly dividend on Wednesday, November 13th,Wall Street Journal reports. Investors of record on Wednesday, December 4th will be paid a dividend of 0.0827 per share by the semiconductor company on Monday, December 23rd. This represents a $0.33 dividend on an annualized basis and a yield of 1.31%. The ex-dividend date of this dividend is Wednesday, December 4th. This is an increase from Amkor Technology’s previous quarterly dividend of $0.08.
Amkor Technology has raised its dividend by an average of 96.6% annually over the last three years. Amkor Technology has a payout ratio of 16.8% meaning its dividend is sufficiently covered by earnings. Research analysts expect Amkor Technology to earn $1.85 per share next year, which means the company should continue to be able to cover its $0.32 annual dividend with an expected future payout ratio of 17.3%.
Amkor Technology Price Performance
NASDAQ:AMKR traded down $0.83 during trading hours on Friday, reaching $25.19. The company had a trading volume of 1,033,581 shares, compared to its average volume of 1,330,952. Amkor Technology has a one year low of $24.10 and a one year high of $44.86. The firm has a market capitalization of $6.21 billion, a PE ratio of 17.38 and a beta of 1.85. The company has a quick ratio of 1.84, a current ratio of 2.06 and a debt-to-equity ratio of 0.21. The stock has a 50-day moving average of $29.30 and a two-hundred day moving average of $32.94.
Analysts Set New Price Targets
A number of research firms have recently weighed in on AMKR. KeyCorp dropped their target price on Amkor Technology from $38.00 to $34.00 and set an “overweight” rating on the stock in a report on Tuesday, October 29th. Needham & Company LLC lowered their price target on Amkor Technology from $45.00 to $34.00 and set a “buy” rating for the company in a research report on Tuesday, October 29th. Morgan Stanley reduced their price objective on Amkor Technology from $35.00 to $26.00 and set an “equal weight” rating for the company in a research report on Tuesday, October 29th. DA Davidson cut their target price on shares of Amkor Technology from $40.00 to $36.00 and set a “buy” rating for the company in a research report on Tuesday, October 29th. Finally, JPMorgan Chase & Co. reduced their target price on shares of Amkor Technology from $48.00 to $42.00 and set an “overweight” rating for the company in a report on Tuesday, October 29th. Four investment analysts have rated the stock with a hold rating and six have issued a buy rating to the company. According to data from MarketBeat, Amkor Technology presently has an average rating of “Moderate Buy” and a consensus price target of $35.63.
View Our Latest Report on AMKR
Insider Activity at Amkor Technology
In other Amkor Technology news, Director Winston J. Churchill sold 20,000 shares of the business’s stock in a transaction dated Tuesday, August 27th. The stock was sold at an average price of $32.97, for a total value of $659,400.00. Following the completion of the sale, the director now owns 19,871 shares of the company’s stock, valued at $655,146.87. The trade was a 50.16 % decrease in their ownership of the stock. The sale was disclosed in a filing with the Securities & Exchange Commission, which is available at this hyperlink. Also, CEO Guillaume Marie Jean Rutten sold 10,000 shares of the company’s stock in a transaction on Tuesday, October 15th. The shares were sold at an average price of $31.51, for a total transaction of $315,100.00. Following the transaction, the chief executive officer now owns 204,971 shares of the company’s stock, valued at approximately $6,458,636.21. The trade was a 4.65 % decrease in their ownership of the stock. The disclosure for this sale can be found here. Corporate insiders own 31.40% of the company’s stock.
About Amkor Technology
Amkor Technology, Inc provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage.
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